Dr. Michael A. Fury has over 25 years experience in bench research, R & D management, IP management, process technology development, production management , marketing management and strategic advisory work in the semiconductor and nanotechnology industries, specializing in advanced and electronic materials. 

In addition to his consulting for NewCap Partners,  Dr. Fury currently is a Senior Technology Analyst for Techcet Group LLC, an electronic materials market consulting group and co-author of Techcet’s CMP Consumables Critical Materials Report.  In addition, he is New Business Development Manager for Electronic Materials at both Ceimig, Ltd., a platinum group metal specialty chemical manufacturer in Dundee, Scotland and Gwent Electronic Materials, a manufacturer of inks for printed electronics, fuel cells, displays and sensors, in Pontypool, Wales.

From 2000 through 2006, Dr. Fury was Vice President of R&D and Engineering at EKC Technology, Inc., part of DuPont Electronic Materials, where he was responsible for new product R&D and IP strategy for EKC’s wafer cleaning chemicals business at four research and applications labs around the world.

Before EKC, Dr. Fury was Senior Manager for CMP and Backgrind with Silterra (Malaysia) Sdn. Bhd., a startup ASIC foundry in Kulim, Malaysia.  His previous roles include Director of Process Integration at AlliedSignal’s (now Honeywell’s) Advanced Microelectronic Materials division developing CMP processes and interconnect integration strategies for low-dielectric materials. Dr. Fury has also held marketing and technical management positions at Rodel in Newark, DE and at Rippey in El Dorado Hills, CA.

Mike managed the early days of CMP implementation for damascene semiconductor interconnects in a 17 year career at IBM in East Fishkill, NY, where he held a variety of engineering and management positions in process and equipment development and manufacturing. During his tenure at IBM, he served on IBM’s corporate Strategic Equipment Council and was responsible for controlling the first release of public information on IBM’s chemical-mechanical planarization (CMP) program. CMP has since become a critical process for the manufacture of integrated circuits.

Dr. Fury has authored and co-authored over 100 articles, short courses and presentations on advanced materials, and is a frequently invited speaker at technical symposia and graduate level seminars. In 2003 was named in the first edition of Who’s Who in Semiconductors. He holds a Ph.D. in Physical Chemistry from the University of Illinois at Urbana.